Updated by 09.07.2023
E-Complish announces content partnership with Payments Journal
E-COMPLISH ANNOUNCES MAJOR CONTENT PARTNERSHIP WITH KEY PAYMENTS AND BANKING INDUSTRY NEWS PORTAL
CEO Stephen Price to regularly contribute industry trend analysis and thought leadership pieces to Payments Journal
E-Complish, a leading payments solutions provider, announced the formation of a content partnership with major payments industry news source Payments Journal. E-Complish CEO Stephen Price, an expert and respected innovator in payment processing technology, will provide the outlet with content on topics including the importance of PCI compliance, developer API solutions, and mobile processing, among others.
“At E-Complish, we’ve always been avid readers of Payments Journal, so when the opportunity to partner with them presented itself, we were very quick to accept the offer,” said Stephen Price, CEO of E-Complish. “I’m incredibly excited to share my knowledge of the industry with the site’s audience and am looking forward to working with Payments Journal’s editors to present readers with great information that can potentially improve their businesses.”
Since establishing the relationship with Payments Journal, Price has contributed a piece on PCI DSS 3.0 lessons for merchants that explains and simplifies the new PCI Compliance standards alongside an infographic the company produced. In addition to the piece, Payments Journal has also profiled Price as part of its Executive Spotlight column.
For more information about E-Complish’s payment solutions visit http://www.e-complish.com/solutions, or view our infographic on PCI Compliance at http://www.e-complish.com/blog/what-is-pci-compliance/.
E-Complish, LLC: Since 1998, E-Complish has helped businesses increase profit and communicate more efficiently with customers through its unique financial services, quickly becoming one of the nation’s most reliable and secure payment partners. For more information about E-Complish, please call 888-847-7744 or visit http://www.e-complish.com.